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PPP-B-601 / D6251 / LPO-001


Events of Interest to Packing and Crating Professionals

Local, National and Global Events


Upcoming Events

Atlanta, GA. USA
February 6-9, 2012

In February 2012, tens of thousands manufacturing, supply chain and logistics professionals from more than 80 countries will come to Atlanta’s Georgia World Congress Center for MODEXSM 2012. They will be greeted by over 500 exhibits covering 150,000 net square feet. MODEXSM 2012 will showcase equipment and systems solutions as well as provide learning opportunities that span the entire supply chain, from material handling to manufacturing to assembly to distribution to logistics to delivery to disposal.


704-676-1190

Chicago, IL, USA
Jan 21st - 24th, 2013
NEC Birmingham, England
May 21st-23rd 2013

As the UK’s leading integrated processing & packaging exhibition, Total Processing & Packaging 2010 showcases production line solutions from beginning to end.

Attracting key professionals from major sectors including food & drink, pharmaceutical, cosmetics, household products and chemicals, there is no better opportunity for exhibiting companies to reach senior decision makers looking to make substantial investment decisions.


Graham Earl
44 (0)20 8910 7890


Past Events


Geneva, Switzerland
March 18-20th, 2011

FNC Group, a division of AM Embassy AG is established in the year 2005. FNC aim is to promote sales and business activities for the freight forwarding companies under one network. Enormous business openings and opportunities are generated in FNC throughout the world to its members in bilateral commitment.



Via Website

Geneva, Switzerland
March 18th-20th, 2011



Elizabeth Shannon


MIL-STD-810G is here at last!  Among suppliers of military and naval hardware, the October 2008 release of Military Standard 810G was long awaited.  Interpreting the Standard will be a short course “Understanding, Planning and Performing Climatic and Dynamic Tests to MIL-STD-810G,” meeting at National Technical Systems (NTS), 1701 E. Plano Parkway, Plano Texas from 8-4 on April 11-14, 2011. 

This 4-day class will provide an understanding of the purpose of each test, the equipment required to perform each test, and the methodology to correctly apply the specified test environments.

Vibration and Shock methods will be covered together and will include an overview of Sine and Random Vibration as well as classical waveform shock testing, drop testing and Shock Response Spectrum Testing. Instrumentation, vibration equipment, control systems and fixture design will be covered.

Each climatic test will be discussed individually, focusing on requirements, origination, equipment required, test methodology and understanding of results.



Wayne Tustin
805-564-1260


MIL-STD-810G is here at last!  Among suppliers of military and naval hardware, the October 2008 release of Military Standard 810G was long awaited.  Interpreting the Standard will be a short course “Understanding, Planning and Performing Climatic and Dynamic Tests to MIL-STD-810G,” meeting at NTS, 38995 Cherry Street, Newark CA on June 6-9, 2011. 

This 4-day class will provide an understanding of the purpose of each test, the equipment required to perform each test, and the methodology to correctly apply the specified test environments.

Vibration and Shock methods will be covered together and will include an overview of Sine and Random Vibration as well as classical waveform shock testing, drop testing and Shock Response Spectrum Testing. Instrumentation, vibration equipment, control systems and fixture design will be covered.

Each climatic test will be discussed individually, focusing on requirements, origination, equipment required, test methodology and understanding of results.



Wayne Tustin
805-564-1260

New York, NY. USA
June 7-9, 2011

FIND new equipment, technology, and materials to lower costs, reduce waste, and increase efficiencies. You’ll see the latest in: bags, containers, contract services, custom automation equipment, machinery and machinery components, materials, packages, package design and printing, robotics, supplies, software...and more. COMPARE suppliers to source better options and improved services. These suppliers are ready to help save you money right now, and offer years of experience in: food, beverage, cosmetics/personal care, industrial, pharmaceutical/nutraceutical, printing/publishing, chemical, appliances, medical devices, electronics, instruments, consumer products, automotive, toys, and textiles. IDENTIFY new, more cost-effective process methods to help accelerate your packaging projects.



Toronto, Canada
June 21-23, 2011

MEET FACE-TO-FACE with leading suppliers. Why spend countless hours online or looking through catalogues when you can spend a day or two at PACKEX meeting with knowledgeable suppliers who can provide you with everything you need. Hundreds of top suppliers are gathered together at your disposal, ready to help solve your challenges and save you money. DISCOVER A RESOURCE HALL FILLED TO THE BRIM with innovations in packaging and processing. Enjoy hands-on access to the latest in flexible packaging, cartons, labels and tags, custom automation equipment, contract services, printing, converting, processing, materials, material handling, software, and much, much more.



Rosemont, IL USA
July 26th & 27th

This event will bring together adhesive and sealent stakeholders, standards and specifications professionals and individuals from consumer goods companies to provide the industry with a "voice" on green terminology. This event for suppliers and manufacturers and others involved with defining "green"



London, KY. USA
Sept. 16-17, 2011

The 2011 Kentucky Wood Expo will be held September 16 & 17, 2011 in London, KY at the Laurel/London Optimist Sports Complex. Click here to download the KY Wood Expo Exhibitor Guide If you have any questions about the show please contact the KFIA office at 502/695-3979 or Michele@kfia.org



Chicago, IL USA
Sept. 20-22, 2011

The MidPack Conference is an educational and networking forum tailored to the specific security needs of professionals in the packaging industry. The conference will focus on pharma, medical devices, and food security challenges. Industry experts will address the packaging security challenges and needs, tools available to resolve issues, and implementation.

The two and a half day program is a combination of technical presentations, panel discussions and Q&A that will provide new insights and practical information you can immediately apply to your job responsibilities.

Specifically, attendees will learn about:

  • Fighting counterfeiting, diversion, and theft
  • Risk management and regulatory
  • Sterilization
  • Secure holographic packaging
  • Functional printing
  • Track and Trace
  • Auto ID – RFID
  • Brand equity
  • Legal challenges
  • Implementing solutions


Cimberly Weir
517-353-6797

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